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    1μF 250V Multilayer Ceramic Chip Capacitor

    $18.19
    SMD multilayer ceramic chip capacitor for sale at low price, 1μF (1000000pF, 1000nF) capacitance, medium rated voltage 250V, 10% tolerance, 1000PCS per roll. This MLCC surface mount capacitor is widely used for household appliances, 2.5mm thickness, and ceramic (porcelain) medium material.
    SKU: ATO-MLCC-250V105K
    This product has a minimum quantity of 10
    30-day Returns
    Free Shipping
    Delivery date: 6-12 days

    SMD Multilayer ceramic chip capacitor is stable and has high capacitance. Laminated monolithic structure, excellent solderability and solder resistance, MLCC capacitors are suitable for reflow and wave soldering, various filtering and coupling circuits.

    Specification

    • Model: ATO-250V105K1210
    • Series: Multilayer Ceramic Chip Capacitor
    • Capacitance: 1μF (1000000pF, 1000nF)
    • Rated voltage: 100V
    • Tolerance: 10%
    • Operating Temperature Range: -40℃ - 105℃
    • Lead Type: SMD
    • Size: 3.2mm
    • Thickness: 2.5mm
    • Package: 1000PCS / roll
    • Application: Household Appliances
    • Medium Material: Ceramic (Porcelain)
    • Loss: 0.01%
    • Weight: 0.3kg

    Structure

    Structure of MLCC multilayer ceramic capacitor

    Structure of multilayer ceramic chip capacitor

    Tips: What causes the multilayer ceramic chip capacitor failure?

    • Thermal crack
      It is mainly due to the temperature shock of the device during soldering, especially wave soldering. Improper rework is also an important cause of temperature shock cracks.
    • Flex crack
      The characteristics of multilayer ceramic capacitors are that they can withstand large compressive stress, but have poor resistance to bending. Any operation during device assembly that may cause bending deformation may cause device cracking. Common stress sources include: SMD alignment, circuit board operation in the process; people, equipment, gravity and other factors in the flow process; through-hole component insertion; circuit testing, veneer segmentation; circuit board installation; circuit board positioning riveting ; Screw installation, etc. Such cracks generally originate from the upper and lower metallized ends of the device, and extend to the inside of the device along an angle of 45°C. This type of defect is also a type of defect that actually occurs the most.
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